As the semiconductor industry races toward 2nm process technology, traditional EUV lithography faces physical limits in patterning ever-smaller transistors. High-NA EUV lithography emerges as the game-changing solution, offering higher resolution, improved yield, and the capability to power next-generation chips for AI, HPC, and mobile devices. This article explores the differences between EUV and High-NA EUV, the science behind advanced optics, the global adoption race led by ASML, Intel, TSMC, and Samsung, and why High-NA EUV is critical for shaping the future of chipmaking.
